Completed Projects

Since our inception in August of 2003 we have completed numerous Top-Level and block designs. A few of these projects are listed below.

Telecom Memory Interface Architecture (2 devices)

Toshiba 0.18 micron process
Flat designs, 350k placeable each
125 MHz core
24 channel serdes per device, running at 250 MHz

Printer Device Controller

UMC 0.18 micron process
Flat Design, 350k placeable
125 MHz core
500 MHz USB

Compression Engine for Printer Application

TSMC 0.18 micron LV process
Flat design, 80k placeable
200 MHz core

DSL Modem

TSMC 0.13 micron LV-OD process
100 MHz core
400 Mbps DDR

Enterprise Processor Bridge

TSMC 0.13 micron FSG process
Block, 400k placeable
370 MHz core

Video (De)Compression Device (2 blocks)

TSMC 0.13 micron process
DDR1, 333 Mbps, 250k placeable
ARM CPU (ARM926 & ARM966 cores), 233 MHz core, 250k placeable

Video (De)Compression Device

TSMC 0.13 micron process
400k placeable (top level)
200 MHz core
ARM926 core, 150k placeable
400 Mbps DDR